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I got it!

The Third International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics (EEETEM2017)

All registered papers will be submitted to IEEE for potential inclusion to IEEE Xplore.

The conference aims to enable researchers build connections between different digital applications and engineering. The conference welcome papers on the following (but not limited to) research topics:

Electronics Engineering
Artificial Intelligence
Circuits and Electronics
Computer Architecture for Intelligent Machines
Electronic Medical Devices
Electronics System-Level Based Design
Fiber Optics and Fiber Devices
Integrated Optics
Low-Power Signal Processing
Mobile Computing

Electrical Engineering
Analog Circuits and Digital Circuits
Antenna and Propagation
Bioinformatics & Biomedical Imaging
Brain-Computer Interfacing and Human–Computer Interfacing
Computer-Aided Surgery
Electric Energy Processing
Electromagnetic and Photonics
Health Care Information Systems
Image Processing
Integrated Optics and Electro-optics Devices
Microwave Theory and Techniques
Mobile Security

Industrial Engineering
Instrumentation and Control
Modeling and Design
Robotics and Automation
Robotics and Mobile Machines
Dynamic Systems and Control
Globalization of Engineering
NanoEngineering for Energy
Computer-aided design, manufacturing, and engineering

Important Dates
Submission Deadline - Open until March 26, 2017
Notification of acceptance - 2-4 weeks from the date of submission or April 5, 2017
Camera Ready submission - April 16, 2017
Registration - Open from now until April 16, 2017
Conference dates - April 26-28, 2017


26 April 2017 @ 12:00 am

28 April 2017 @ 12:01 am

Duration: 2 days


Faculty of Engineering - Lebanese University

Campus Université Libanaise, Hadath, Beyrouth, Liban - Roumieh

- Roumieh


Organised by

The Society of Digital Information and Wireless Communications (SDIWC) (view profile)

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