We use cookies to personalise content and ads, to provide social media features and to analyse our traffic. Read more about our Privacy Policy.

I got it!

Event
31 Jul 2017
ICT

The Third International Conference on Electronics and Software Science (ICESS2017)

ICESS2017

The Third International Conference on Electronics and Software Science (ICESS2017) 

http://sdiwc.net/conferences/3rd-international-electronics-software-science/

Takamatsu Sunport Hall Building, Takamatsu, Japan

July 31 - August 2, 2017

******************************************************************************************************
The conference aims to enable researchers to build connections between different digital applications.

The conference welcome papers on the following (but not limited to) research topics:

- Advanced Power System and Control System    
- Analog and digital circuit Design
- Automobile Engineering    
- Broad Band Communication
- Communication    Computer and Intelligent Communication
- Control and Robotics    
- Disaster Prevention Engineering
- e-Healthcare System    
- Electromagnetics and Photonics
- Ergonomics and Application
- Expert Systems and Artificial Intelligence Techniques
- Feedback Control Systems    
- High Voltage Engineering
- Information systems and network security
- Kansei Engineering
- Measurements and Instrumentation    
- Mechatronics and Avionics
- Medical Engineering    
- Nano Devices and Integrated Systems
- Non Conventional Energy Resources    
- Optical Networks & communication
- Power Electronics    
- Power Electronics & Electric Drives
- Power Electronics and Energy Efficient Drives    
- Power Quality Improvement Techniques
- Power Systems    
- Processing and Multimedia, Biomedical Imaging
- Remote sensing and satellite communication    
- RF and Microwave Engineering
- Sensor technology & Virtual Instrumentation    
- Server Virtualization Technology
- Soft Computing Techniques in Power Systems    
- Software for Life Science
- Software for Material Science    
- System Modeling & Simulation
- Systems Science and Signal Processing    
- VLSI technology & Design
- Affective Computing    

******************************************************************************************************
IMPORTANT DATES:

Submission Deadline: Open from now until June 30, 2017
Notification of Acceptance: 4-7 weeks from the Submission Date
Camera Ready Submission: July 21, 2017
Registration Deadline: July 21, 2017
Conference Dates: July 31 – August 2, 2017

When

31 Jul 2017

2 Aug 2017


Where

Takamatsu Sunport Hall Building, Takamatsu, Japan

1312-7 Konanchooka, Takamatsu, Kagawa 761-1401, Japan

760-0019 Takamatsu

Japan


Language

English en


Organised by

SDIWC HK (deactivated)

Featured Events